新包装乐泰UF3810 原装正品乐泰UF3810 代理乐泰UF3810胶水销售联系：137.511.6332陈生 Q/Q.30.222.4564.
LOCTITE ECCOBOND UF 3810 reworkable epoxy underfill is
designed for CSP and BGA applications. It cures quickly at moderate
temperatures to minimize stress to other components. When cured,
this material provides excellent mechanical properties to protect solder
joints during thermal cycling.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, @ 25 °C , mPa?s (cP):
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